Manufacturing and inspection equipment

Texus fully automatic epoxy die bonder [EBD4350S]

Manufacturing and inspection equipment

Texus fully automatic epoxy die bonder [EBD4350S]

Fully automatic epoxy EBD4350S

[Texus]
Fully automatic epoxy die bonder

Texus fully automatic epoxy die bonder [EBD4350S]
ItemSpecifications
Bonding system Epoxy system
Option: DAF(Die Attach Film)
Chip size Min. □0.2mm-Max.□5.0mm
Bonding precision XY = ±μm(1.5mils)@3sigma
Bonding load 0.3N-1.2N(5N)
Supported work Strip plastic lead frame, carrier tape
Lead frame width/length Width : -75 mm
Length : 100 – 280 mm
Wafer size Supports up to φ8‘’
Machine cycle time 0.25 sec/chip (varies with conditions such as work width and chip size)
Transfer system Gripper transfer system
Loader Adsorption stacker or magazine stacker, Option: Double loader
Unloader Magazine stacker
External dimensions Adsorption stacker loader / Multi-magazine unloader : 1,300(W) x 1,135(D) x 1,620(H)mm
Multi-magazine loader / Multi-magazine unloader : 1,600(W) x 1,135(D) x 1,620(H)mm
Weight Approx. 1,200kg
Necessary equipment Power supply: 200 – 240 VAC+/-5%, 50/60 Hz
Max. 25 A (5 kVA) Main power supply: 10 A, Heater power: 15 A
Vacuum source: -73.3 kPa or more
N2 gas: 0.4 MPa or more
Options
  • High-precision bonding using a vacuum clamp
  • New-type rotary bond head enabling θ control
  • Helps reduce production losses by post-bond recognition and wafer map support
  • Auto wafer loader

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