Manufacturing and inspection equipment
Texus fully automatic flexible epoxy die bonder [DBD4200R]
Manufacturing and inspection equipment
Texus fully automatic flexible epoxy die bonder [DBD4200R]
Fully automatic flexible epoxy
DBD4200R
DBD4200R
[Texus]
Ultrahigh-speed
machine cycle: 0.15 sec
![Texus fully automatic flexible epoxy die bonder [DBD4200R]](https://www.e-globaledge.com/wp-content/uploads/2020/03/photo_dbd4200r_01_l-e1585017087581.jpg)
| Item | Specifications |
|---|---|
| Machine cycle time | 0.15 sec/chip |
| Bonding system | Eutectic system |
| Supported work | Hoop-shaped lead frame (width: 20 – 60 mm) |
| Head operating range | x=4mm y=56mm max. |
| Chip size | □0.25~□0.80mm |
| Wafer supply | Supporting 6” and 8” wafers |
| Bonding load | 19.6 – 122 cN (20 – 120 g), digital setting |
| Bonding stage temperature | Room temperature – 500 °C |
| Bonding precision | X, Y: ±50μm θ: ±3°C |
| Chip recognition | Value multiplexing |
| Work recognition | Value multiplexing |
| Bonding tool | Flat (face) type |
| Production control data | Output, number of good/non-good chips, time of stop on error, operating time, tool life, number of chip failures, tool life |
| Optical system | CCD camera |
| External dimensions of the main unit | 1,100(W) x 1,100(D) x 1,880(H)mm |
| Weight | Approx. 750 kg |
| Necessary equipment | Power supply : 200 VAC; 50/60 Hz Vacuum source : -0.07 MPa or below N2 gas : 0.1 MPa or more Air source : 0.4 MPa |
| Options |
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- Texus fully automatic flexible epoxy die bonder [DBD4200R]
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