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Semiconductor Manufacturing Equipment

We offer market-proven, reliable manufacturing equipment, including materials, and state-of-the-art technology based manufacturing equipment in semiconductor parts manufacturing processes. Based on our past achievements, we have built a global sales network, through which we can offer these products in various ways such as customizing them or developing new products or producing a line of solutions based on them.

Packaging-Process

DBD4600S

DBD4600S

[TOSOK]
Full Density Discrete PKG Die Bonder

EBD4350S

EBD4350S

[TOSOK]
Full Automatic Flexible Epoxy Die Bonder

DBD4200

DBD4200

[TOSOK]
Super High Speed machine
0.15sec/cycle

ACT200

ACT200

[ALPHA Design]
Pick & place machine for chip to be transferred from tray to tape.

Wafer-Process

LSE-7000

Silicone and compound etching equipment
LSE-7000

[LEED Corporation(Korea)]

LSC-7000

PE-SiH4 CVD process
LSC-7000

[LEED Corporation(Korea)]

LSE-8000

metal and ferroelectric material etching equipment
LSE-8000

[LEED Corporation(Korea)]

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