EBD4350S [TOSOK]
| Item | Specifications |
|---|---|
| Bonding Method | Epoxy dispense Option: DAF (Die Attach Film) |
| Chip size | Min. □0.2mm-Max.□5.0mm |
| Bonding accuracy | XY = ±μm(1.5mils)@3sigma |
| Bonding weight | 0.3N-1.2N(5N) |
| Lead frame | Strip type plastic lead frame or carrier tape |
| Lead frame Width & Length | width: -75mm length: 100-280mm |
| Wafer | capability to handle maxφ8'' |
| Machine Cycle time | 0.25 sec /chip (Epoxy dotting/≦□2.0mm(80mls) die ) |
| Indexer | Gripper method |
| Lead frame input (station) | Vacuum stacker embeded or Magazine stacker /option Double loader |
| Lead frame output (station) | Magazine stacker |
| Overall size | Vacuum stacker /Multi magazine unloader 1,300(W)×1,135(D)×1,620(H)mm |
| *Excluding signal tower height | Magazine loader / Magazine unloader 1,600(W)×1,135(D)×1,620(H)mm |
| Mass | 1,200kg (approximately) |
| Utilities | power：AC200-240V±5％, 50/60Hz Max.25A(5kVA) Main power：10A, Heater Power：15A Vacuum：more than -73.3kPa N2gas：more than 0.4Mpa |
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