DBD4600S [TOSOK]
| Item | Specifications |
|---|---|
| Bonding Method | Epoxy dispense or Eutectic Method DAF(Die attach Film) |
| Chip size | Min.□0.2mm-Max.□3.0mm |
| Bonding accuracy | XY = ±35μm(1.5mils), 3sigma |
| Bonding weight | 0.3N-1.2N(5N) |
| Lead frame | Strip type plastic lead frame or carrier tape |
| Lead frame Width & Length | width: -60mm |
| Wafer | length: 150-260mm capability to handle maxφ8'' |
| Machine Cycle time | 0.35 sec/chip(epoxy dotting) 0.25 sec/chip(Eutectic) |
| Indexer | Index pin or Gripper (for Epoxy only) |
| Lead frame input (station) | Multi magazine / Vacuum stacker |
| Lead frame output (station) | Multi magazine |
| Overall size | 2,200(W)×1,250(D)×1,880(H)mm |
| Mass | 1,000kg (approximately) |
| Utilities | Electric sourse：AC200-240V±5％, 50/60Hz Max.25A(5kVA) Main power：10A, Heater power：15A Vacuum：more than -73.3kPa N2 gas：more than 0.4Mpa Air：more than 0.2Mpa |
| Options |
|
