DBD4200 [TOSOK]
| Item | Specifications |
|---|---|
| Cycle Time | 0.15 sec /cycle |
| Bonding Method | Eutectic Bonding |
| Lead frame | Reel type (Max width:60mm) |
| Head operating area | x=4mm y=56mm max. |
| Chip size | □0.25～□0.80mm |
| Wafer | 6'', 8'' wafer |
| Bonding weight | 19.6～122cN(20～120g) Degital setting |
| Workstage temperature | Room temperature～500℃ |
| Bonding accuracy | X, Y: ±50μm θ: ±3℃ |
| Chip recognition | Grayscale |
| Work Recognition | Grayscale |
| Bonding tool | Flat collet etc |
| Statistical data | Product quantity, Good chip, NG chip, Machine stops by error Miss chip ,Power-on hour, bonding tool life |
| Optics | CCD camera |
| Machine dimension | 1,100(W)×1,100(D)×1,880(H)mm |
| Weight | 750kg (approximately) |
| Utilities | Power: AC200V 50/60Hz Vacum: less than -0.07MPa N2 gas: more than 0.1Mpa Air: 0.4MpaAir: 0.4Mpa |
| Options |
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