E-Globaledge Coporation

Home > Solutions > Optoelectronics & Semiconductor > LED / Optical Communication > LED Test Equipment

LED Test Equipment [SEIWA ELECTRIC MGF.CO.,LTD.]

LED Die Brightness / Wavelength Sorter
Model:ALPHA 3200/3200F

Features

  • Possible to measure LED Die’s Brightness/wavelength factor at the same time and then classifies them into maximum 32 tracks depend on the measurement data. (Standard 21 ranks)
  • Parallel driving with high speed rotation table makes High Throughput 0.8 sec/Die.
  • On-top double electrodes, On-top single electrode and Flipping Die (ALPHA3200F) can be sorted.
  • Die shape inspection can be realized with image processing.
  • User-friendly operation with 10-inch touch panel screen.
  • Compact design and minimized footprint.
<Machine Specification>
Dimension 990W x 1120D x 1817H mm
Weight 600kg approx
Power 100V±10% 50/60Hz (1.2kW)
Air
(provided by customer)
Dry clean air 0.5-0.7MPa
Vacuum
(provided by customers)
Less than 13 x 103Pa
Operating Condition 17-28℃, 40-70% RH
<LED Chip/Wafer>
Standard Aluminum
Wafer Ring
OD dia. 145mm, ID dia. 130mm
Sheet: more than 160mm SQ
Pick Up Area Max. dia. 100mm
Chip Size 0.2-0.5mm SQ up to 1mm is available as option
Chip Thickness 0.09-0.5mm (distribution less than 10% sheet)
Chip Rotation Less than 15 degree
Electrode More than dia. 0.1mm
<Measurement>
Optical
Characteristics
Polychrome meter:
Relative Brightness & Wavelength (peak/ dominant)
λd: 380-780nm, λp: 380-980nm etc: (x,y), purity
Condition of lighting Lighting with Stage current (0.001-100mA) or Stable Voltage (0.01-10V)
Forward Voltage 0.01-10V (IF = 0.001-100mA 10points)
Forward Current 0.01-100mA (VF = 0.0-10V 10points)
* Higher impression current range 0.001-1000mA is available as optional function
Reverse Voltage 0-100 V (IR= 0-100μA)
Reverse Current 1-100μA (VR= 0-100V)
Die shape inspection OK/NG judgment is to be done by area ratio or pattern matting. Pickup process is skipped as to NG Die.
<Others> Tact time is according to the data by standard optical instrument
Tact Time min. 0.8sec/chip w/o Data output
No. of Sorted rank Brightness/ Wave length: Matrix placement (max 31 ranks) + NG sheet (option), Standard 20 rank + NG sheet
Operation Selective operation screen (touch panel): Sorting Adjustment, Setting, Chip Information
Measured Data Display / Output of measurement Data at real time
Memory Capacity of Set Condition Set Condition/ Wafer : max 100kinds
Data Output RS232C (Measured data, Mapping Position Data, etc.)
  • Inquiry concerning this page

TOP

Page NO:ESO-C017

Recommended environment
【Windows】Internet Explorer 6.0, Firefox 2.0【Macintosh】Firefox 2.0, Safari 2.0