Laser Micro Processing Equipment [Laser Solutions Co., Ltd]
Laser micro processing equipment based on a unique processing technique
Features
- Realizes long-time stability, full automation, and high-speed processing to support mass production
- Employs Laser Solution's own LMA processing technique (*1).
- Features a compact design to save space. It is easy to operate, requiring no special skills or experience for daily operations.
*1: LMA (Laser Melting Alteration: patent pending) is a method for scribing by alteration rather than by elimination of materials to process. This processing technique can efficiently dice wafers into high-quality chips without spattering particles on wafer surface. It allows high-speed, high-quality scribing of sapphire and other hard-brittle materials.
General
Laser Solution Co., Ltd. is engaged in R&D, manufacture, sale, and maintenance of laser processing equipment for semiconductors. Full automatic machines based on its technologies are highly praised and trusted by users at home and abroad.
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[Laser scribing by LAM]
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[General laser scribing]
