Die Bonding Process [Four Technos]
Automatic Die Bonder
Mode：FT-4000
Features
- For TO-CAN and Butterfly packages
- Submount bonding inside Butterfly packages
General
Four Technos Co., Ltd. is leading company of Bonding system for Optical device in Japan. Their experience of Full-automatic system is user friendly and highly appreciated by domestic & overseas user.
FT-4000 Die Attach system
- Developed especially for optical device
- Capable to accomodate various requirements, and suitable for the mass production
- Two bonding methods : Thermocompression and Conductive Paste
- Two chip-feeding methods : Smaller, larger chips or different sizes simoltaniously
- Simple replacement of bonding, working tools
FT-5000 Die Attach system
Model FT-5000 is for high accuracy die attach. Positioning is done by visual system. The advantages of this system are that cycle time is very short in spite of high accuracy system and that this system has several handling tools so that several kind of chip are available at once.
| Specification | ||
|---|---|---|
| Bonding method | Thermocompression or Conductive paste | |
| Bonding accuracy | ±10μ～±30μ(Subject to shapes and tolerance of headers and chips) | |
| Cycle time | 6sec/2chip bonding (excluding Die bonding time) | |
| Heating method | Header | Temperature controlled cartridge heater |
| Flat package | Themperature controlled ceramic heater | |
| Bonding mode | Selection of various mode (ex. Scrubing) | |
| Heating temperature | Ambient to ~ 500°C(Celsius) | |
| Positioning method (Possible to select) |
Mechanical | |
| Pattern recognition | ||
| Bonding pressure | 0.049N(5gf) ~ 1.96N(200gf) Need to change a spring | |
| Header supply method | Loading and Unloading with same tray | |
| Header feeding tray | Side by side lay-out for small production or stackable magazines for mass production | |
| Header feeding tray | 2inch, 4inch and expanding sheet (Conbination using is possible.) | |
| Chip recognition | Center of gravity and Pattern matching | |
| Q'ty of tray supplied | Tray for Small chip x 9pcs Tray for Large chip x 9pcs (in the case of 2inch) Possible to change the chip tray supply method according to Customer's request |
|
| Header size | 0.5mm ~ 20mm (Need to change unit) | |
| Chip size | 250μm~ 2mm (Need to change collet) | |
| Bonding tool (Designed according to specifications) |
Flat vacuum collet | |
| Pyramidal vacuum collet | ||
| U-shaped vacuum collet | ||
| Mechanical chucking collet | ||
| The other type of collet | ||
| Option | Ribbon preform feeding | |
| Height compensated by Load Cell | ||
| 90 degree rotative die bonding | ||
| Accessaries | Input power | AC220V,AC200V,AC110V,AC100V 50/60Hz |
| Power consumption | 20A approx(AC100V) | |
| Compressed air | 500kPa(5kgf/c㎡)10l/min | |
| N2 | 300kPa(3kgf/c㎡)30l/min | |
| Vacuum | Supplied with vacuum pump (Accessary) | |
| Dimension | 1600mm(W) x 1100mm(D) x 1900mm(H) approx. (excluding signal tower) | |
| Weight | 1000kg approx | |
