Wire bonding process [Four Technos]

Wire bonding process

[Four Technos]
Flexible bonding capability

Automatic Wire Bonder

Spec Table

Product specifications
Bonding system Ultrasonic thermo compression bonding
Total bonding precision ±5μ (based on our standard sample)
Bonding speed Flat area 0.3 s / 2 mm (with loop control), depending on each device
Multilevel bonding (3mm) 0.5 s / 2 mm (with loop control), depending on each device
Bonding wire length 7 mm, depending on each device
Control resolution XY table: 1.0μm; Z1 axis: 1.0μm; Z2 axis: 1.0μm
Heating system Constant heating by a cartridge heater
Heating temperature Room temperature - 300°C
Recognition method Recognition method Value multiplexing correlation system
Detection speed Within 0.3 s / Correction of two points (including travel time)
Recognition range 1/3 inch CCD 0.9 mm x 1.2 mm (with 4x lens)
Maximum bonding area Max. X: 40 mm: Max. Y: 40 mm
Wire diameter Gold wire: φ20μ - 38μm, 2-inch double flange spool
Number of bonding wires Max. 256 wires, 1 type
Number of registered types 20 types (depending on recognition registration patterns)
Work supply form Supplied and stored with a dedicated tray. 2 inch and 4 inch trays are available (optional).
Number of work trays supplied Selectable are units for small-lot production only for flat surfaces and those for mass production which can set several trays.
Work transfer tool (designed according to specifications) Flat vacuum collet
Clog-shaped vacuum collet
Mechanical chuck collet
Other special collets
Specifications Power supply 220 VAC, 200 VAC, 110 VAC, 100 VAC, 50/60 Hz can be selected.
Power consumption Approx. 10 A (at 100 VAC)
Compressed air 500 kPa (5 kgf/cm2) 10 l/min
Nitrogen 300 kPa (3 kgf/cm2) 10 l/min
Vacuum Supplied with the included vacuum pump
Dimensions Approx. 1,200 mm (W) x 1,100 mm (D) x 1,900 mm (H), excluding the signal tower
Weight Approx. 800 kg