Optical communication systems

Chip test process

Chip testing and sorting system that achieves high-speed measurement and stability

Cap welding process

Supports all machines from manual to fully automatic.

Die bonding process

For TO-CAN and butterfly packages

Wire bonding process

Responds to various bonding demands flexibly.

TO CAN test process

Compliant with the Telcordia standards. Supports characteristic testing between -40°C and +85°C.

Alignment and welding process

Low-PWS and stable YAG welding